The call is now open for submission of abstracts to present at IMAPS-UK’s annual meeting: MicroTech2017, taking place at the Rutherford Appleton Laboratory (RAL), Didcot near Oxford on 16th March 2017.
The theme will be Advanced Packaging and Technology Trends.
Those wishing to present either a paper or poster must submit a 200-300 word abstract by November 30th 2016, to: firstname.lastname@example.org
IMAPS-UK’s next conference, on Embedded Device Technology (EDT), will be held on Thursday the 22nd of September. This Unique Conference, organised by NMI and IMAPS-UK, being held within the Mitel Facility in Caldicot is your opportunity to learn how embedded die technology can miniaturise, improve performance and reduce cost for applications such as power, wireless and wearables.
Key speakers from: Fraunhofer, Microsemi, BPA, and ASE.
Exhibition & networking opportunities
Castlegate Business Park
For more information and to book your ticket:
A message from Innovate UK
Launching the infocus Awards for Women In Innovation
We need your help.
Our role at Innovate UK is to identify and nurture the next generation of brilliant innovators. Women are under-represented in the field of innovation, and that needs to change.
It means as a nation we’re failing to harness, capitalise on and celebrate the entrepreneurial talent of female innovators to the detriment of our economy. Boosting female entrepreneurship could deliver approximately £60bn extra to the UK economy.
So we’re launching a special award for women working in innovation, and that’s where you come in.
What are the infocus Awards?
The infocus Awards will celebrate and reward women working across 4 key sectors – Materials & Manufacturing, Health & Life Sciences, Infrastructure Systems, Emerging & Enabling Technologies.
Twelve women will benefit from a valuable tailor-made package of support and four of these will each receive a £50,000 grant to get her brilliant idea up and running.
Could it be you? Could it be someone you work with? Who do you know who could fly the flag for women in innovation?
Help us spread the word
Women in innovation – the UK economy needs you! Are you who we’re looking for? Do you work with someone who’s just right for this award? Please spread the word, and let’s get more women in.
Follow the conversation on twitter #infocus
North Star House, North Star Avenue,
Swindon SN2 1UE
Are you up to date with recent advances in dicing technology? Could your company benefit from a better understanding of dicing blades or from learning about laser dicing? Would you like to hear how several companies are using the latest developments to address the challenges they face?
Register for our workshop on Dicing Technologies, Thursday May the 19th in Norwich. The event is sponsored by Micross, who will offer all attendees with an opportunity to visit their facilities.
Here is a copy of what our partners Jemi wrote about the event:
“……many of the companies using advanced wafer dicing are also customers of more front end orientated products especially as dicing becomes more technically challenging with hybrid wafers and sensitive MEMS devices and so on. This needs many of the chemicals that are common in front end processes and metrology and analytical techniques also. Recent developments using plasma dicing for ultra low damage and cleanliness requires all the accompanying products of any other deep etch process and is becoming increasingly the process of choice.
You may also not know Micross who are a specialist microelectronics manufacturer making devices and RF products for challenging applications in the military and aerospace arenas and also medical, oil and gas and now also own ELTEK SEMICONDUCTORS in Torquay. These meetings are an excellent opportunity to meet and learn with potential customers in this area, it is another great networking opportunity for you.”
|08.30||Registration & Coffee|
|09.00||Welcome & Introduction|
|09.15||Session 1 –“Basics of Dicing” – Andy Longford -PandA Europe|
|10.00||Session 2 – “Blade Technologies” – John Govier – Inseto|
|11.30||Session 3 – “Dicing Equipment and Capabilities” – Christoph Epple – Disco|
|12.30||Lunch & Networking|
|13.15||Micross Facility Tour|
|14.00||Session 4 – “New Dicing Technologies”
a) Laser Technologies – Andy Longford – PandA Europe
b) Plasma – Richard Barnett – SPTS
|15.30||Session 5 – Application Case Studies
b) FSL – Fico
c) Inseto – ADT
|17.00||End of workshop|
We have reached 100 registrations so don’t delay, register NOW to secure your place.
Our annual MicroTech event enables you to keep up-to-date with the latest technology and developments, plus network with leading experts and companies in the sector.
Here are our top ten reasons why you should attend:
1. UK’s only dedicated Microelectronics / Advanced Packaging event.
2. Nine presentations on the latest developments & technologies.
3. Keynotes from: Semefab, Unisem & System Plus.
4. A Unique panel session on “Engaging with Industry for Academics” to explore alternative ways to acquire know-how, expand your expertise.
5. High-impact academic research session with 13 posters presentations.
6. 18 table top exhibits from leading suppliers.
7. Low cost to attend: free parking, buffet lunch & refreshments.
8. Extensive networking opportunities (over 100 attendees).
9. Incorporates the IMAPS-UK Annual General Meeting.
10. Organised by the industry experts IMAPS-UK.
Delegate Registration: The event is open to all, including non IMAPS-UK members, the following delegate rates apply:
Event Partners: £95
Non Member: £125
All prices plus VAT.
Register HERE now to secure your place!
Full details can be found on our website (www.imaps.org.uk).
We look forward to seeing you at MicroTech.
Note: we have two exhibitor table-tops available – to reserve yours contact the IMAPS-UK Secretariat: Telephone: + 44 (0)131 202 9004 or Email: email@example.com
On 28 January we will be holding a Low Temperature Joining workshop at the HENKEL facility in Hemel Hempstead. This is a full technical workshop about Adhesive technologies that is supported by Henkel Electronics Adhesives and will include presentations from CPI, GEM, NPL , Pragmatic, Novalia and Fraunhofer EMT. Places are limited to 50 persons only and only a few places remain. For more info: http://uk.imapseurope.org/index.php/event-main/events-jem/event/10-ltjws
On 17 March our Annual conference, MICROTECH, will take place at Heriot-Watt University, Edinburgh. The theme this year is “Sensors, MEMS and Advanced Packaging” and we have a range of excellent speakers, the usual exhibition and posters plus a session of high-impact short research presentations. Places are already being booked for the exhibition as well as delegates so visit the IMAPS-UK website to register: http://uk.imapseurope.org/index.php/event-main/events-jem/event/7-utech-16
The Annual general meeting will also be held during the MicroTech event, as usual. If you want to be part of the IMAPS-UK organisation, member nominations for committee will be sent out in February along with the AGM meeting notice.
Finally, IMAPS-UK will be holding a DICING Technology workshop on Thursday 19 May, at the Mercure Hotel, Norwich. This event will cover all aspects of dicing from blade technology through to the new Plasma dicing options. For more info on this and all other IMAPS-UK events: http://uk.imapseurope.org/
IMAPS Nordic has announced that their 2016 conference will be held in Norway at Tønsberg in the centre of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo. The call for abstract or suggestion for papers is out and must be non-commercial and submitted in electronic form to firstname.lastname@example.org no later than March 7, 2016. Speakers will be notified of paper acceptance by email by March 20. For the latest information about the conference and the exhibition, visit the homepage at: http://nordic.imapseurope.org/
Conference on Electric Contacts, organised organised by Heriot-Watt University in Edinburgh, 6-9 June 2016. The conference will be of interest to some of our members, especially those in the power and automotive industries. It is a bi-annual conference and this one is led by Jonathan Swingler. More information is available at the conference webpage: http://contacts2 016.com
The distributed fibre optic sensor market stood at $585 million in 2013 and is projected to approach $1.05 billion in 2019. (According to analysts Research & Markets). In particular, the military market segment is showing signs of growing more rapidly than any other. A Possible good reason for IMAPS-UK to consider a Photonics Packaging conference in the latter part of 2016 – in conjunction with JEMI and EPIC.
Another report provides the segmentation of existing and future photonics technologies embedded in cars as well as market forecasts of Photonics in all segments : ADAS (Advanced Driver Assistance System), Interior of the cabin, Exterior of the car, Powertrain. ADAS is one of the most promising segments in terms of economic perspective for photonic technologies manufacturers. Indeed, the market of Photonics in ADAS will grow from around $2.8b in 2014 to around $9b in 2020 with a CAGR2015-2020 of around 22%. Today limited to few thousands of units per year in the luxury car segment, high-end photonic systems have the potential to reach tens or hundreds of millions units/year thanks to strong cost decreases while keeping high performance abilities.
In another report, R&M state that the Optoelectronic Components Market Is Expected to Reach USD 55.53 Billion by 2020. This report focuses on optoelectronic components which are semiconductor devices that are capable of interacting with light (photonic detectors and LEDs come to mind )….. These components have unique features of their own which makes them an ideal choice for a wide range of applications. This optoelectronic components market was valued at USD 32.17 Billion in 2014. Just considering Infrared Photodetectors, these are reaching new opportunities in Defence systems and also in commercial and industrial markets . The IR imaging Photodetectors market is expected to grow from around $700M in 2013 to more than $900M in 2020. The VCSEL market was valued at USD 611.3 Million in 2014, and is projected to grow at a CAGR of 21.99% from 2015 to 2020, expected to reach USD 2,105.3 Million by 2020.
This educational Workshop, organised by IMAPS-UK is being held on the 28th of January at the Henkel UK facility and is your opportunity to learn and to explore the technologies of Low Temperature Joining processes for packaging and assembly in Electronics.
Low temperature Joining is now a required and essential packaging technology for products using Flex, Plastic and Printed electronics. The development of materials and adhesives has made significant advances to meet the challenges in designs, materials and environments.
The programme will consist of 5 workshop sessions covering all aspects of the joining process as highlighted above and will include short case studies covering a range of related applications and technologies.
The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues of low temperature adhesive bonding and its applications in electronics packaging.
This workshop will cover:
- An Introduction to the Markets for Flex, Plastic & Printed Electronics Systems
- Materials & Processes for Successful Low Temp Joining
- Quality, Testing and Reliability
- Application Examples
The programme will consist of 5 workshop sessions, for a detailed agendo see: http://uk.imapseurope.org/index.php/event-main/events-jem/event/10-ltjws
The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area.
JEMI are holding a Technical Visit, Workshop & Exhibition at Airbus Defence and Space in Portsmouth on Thursday 17th December (also next week!)
The main area of interest there is in making instrumentation which includes all kinds of sensors, solar energy collectors, power management and radar and observation instruments, all of which involves technology in our area. Our host will be Lee Birch who is the Technology Engineering Manager and Ralph Green who is the R+D Manager who will be assisting. There will be other attendees and speakers from Airbus on the day, and as usual there is a table top exhibit space adjacent to the meeting room where we will be circulating during the breaks. Publicity will advertise the exhibits to the employees who can visit to during the lunch break.
The day will start at 09.30 with coffee and registration and will continue until 4pm. The site is a secure site so registration must be completed on the JEMI website and you will not be able to just turn up on the day and get in. Non British passport holders will need 5 days before the event for security clearance and all others 2 days so please don’t leave it until the last minute.
The exhibition and event as a whole is free to members of JEMI and IMAPS. For non-members the cost is £50 for the event and £50 per table top. Please register for this event via the following link as soon as possible: WWW.JEMIUK.COM
“Power Electronics – Thermal Characterisation & Reliability” – at the University of Nottingham, Tuesday 15th December 2015
You are invited to spend the day with the University of Nottingham learning about the latest measurement system for fast, accurate, automated power cycling of power electronics components (MOSFETS, IGBTs, etc.) with integral thermal stack characterisation to track cause and effect for failure analysis. There will be presentations from the University of Nottingham and Mentor Graphics plus a lab tour, including a demonstration of the MicReD Power Tester 1500A.
This one day event is offered free of charge and complimentary refreshments and lunch are provided. To reserve your place, please register today by following the link below – numbers are limited and availability is on a first come, first served basis!