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Next generation electronics: research update

January 3, 2013

Using a new method for precisely controlling the deposition of carbon, researchers have demonstrated a technique for connecting multi-walled carbon nanotubes to the metallic pads of integrated circuits without the high interface resistance produced by traditional fabrication.

Plessey Semiconductors is now sampling gallium nitride-on-silicon light-emitting diodes, which it says are cheaper to produce than LEDs fabricated with sapphire substrates or silicon carbide LEDs. The chipmaker collaborated with CamGAN, a spinoff from the Cambridge University Centre for Gallium Nitride, on the development of the LEDs, which are scheduled to go into volume production in March.

Lockheed Martin scientists have developed a new nanoparticle copper-based solder that it says will produce joints with up to 10x the electrical and thermal conductivity of today’s tin-based materials.

A MEMs device is the basis for a gas-flow sensor that is meant to replace mechanical gas meters. The sensor combines a thermal-flow transducer MEMS from Omron with a front-end analog chip made by STMicroelectronics. Omron will initiate sampling of the sensors in November.

Provided by A Longford – PandA Europe

From → Packaging news

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