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“Coil on Module” package and more packaging news

March 19, 2013

Coil on Module package:

Dual Interface cards, which are used for both contact-based and contactless applications, are a fast growing segment of the global payments industry. According to market research firm IMS, the share of dual interface cards used in the global payment chip card market could rise from 18.9% in 2012 to 70.5% by 2017 when over 3.5 billion payment and banking cards could be shipping.

Currently, manufacturers of dual interface smart cards have to connect the chip module to the card’s embedded antenna via soldered connections or conductive paste.   However, a new ‘Coil on Module’ package, from Infineon, combines a security chip and an antenna that makes a radio frequency connection to the antenna embedded on the plastic payment card, through inductive coupling. Thanks to the RF link, the ‘Coil on Module’ technology removes the need for a mechanical-electrical connection and makes the cards inherently more robust. It also simplifies card design and manufacturing, making it more efficient and up to five times faster than with conventional technologies.

Other Packaging news in brief:

Quik-Pak, a division of Delphon, has announced its 8-Lead SOIC (Small Outline Integrated Circuit), the newest addition to the Open-molded Plastic Package (OmPP)™ product line. This 0.150” narrow body package is built to JEDEC standard MS-012 and is RoHS compliant. It is Ni/Au plated which is excellent for wire bonding. Quik-Pak’s 8-Lead SOIC has a standard 0.050” lead pitch and a superior sealing surface for air cavity applications. Quik-Pak’s OmPP product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations.

ROHM Semiconductor has developed what the company claims is the smallest transistor package on the market optimized for thin, compact portable devices. The VML0806 measures 0.8 mm × 0.6 mm, with a height of 0.36 mm and will have applications in portable devices such smart-phones and digital cameras.

Microsemi is offering silicon carbide-based standard power modules with temperature ranges meant for industrial applications. The power modules can be used in high-power switch-mode power supplies, motor drives, oil exploration equipment, solar inverters and uninterruptible power supplies.

Provided by A Longford – PandA Europe


From → Packaging news

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