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MEMS market outlook

April 19, 2013

Researchers in AIST Japan have devised a microelectromechanical system (MEMS) fabrication technology using printing and injection molding, fabrication of large-area devices with low capital investment, without a vacuum process, and lower production costs. Thus, MEMS devices will be available in fields where manufacturing cost has been an issue, such as lighting. Injection molding can be used easily to form complex 3D objects such as spheres; the researchers expect MEMS devices will be formed on the surface of, or inside, 3D objects. Moreover, injection molding processes are commonly available in Japan, and systems cost less than semiconductor manufacturing systems. AIST projects its work will lead to MEMS fabrication coming out of non-semiconductor industries, such as plastics molding — and participation from these other sectors into MEMS manufacturing will help develop new applications for MEMS devices.

Bosch Sensortec has transferred its portfolio of high-precision automotive MEMS expertise to craft mass-market versions for consumer devices, the latest of which is the world’s smallest barometric sensor.   Bosch claims its 2-by-2.5-by-.95 millimeter package has a 65 percent smaller footprint than the last generation.

X-FAB Silicon Foundries has increased its share in the German-based MEMS Foundry Itzehoe GmbH (MFI) from 25.5 percent to 51 percent, becoming the majority shareholder, and also renamed MFI as X-FAB MEMS Foundry Itzehoe.

Provided by A Longford – PandA Europe

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