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Don’t miss Microtech 2014 on March the 20th at Rutherford Laboratory near Oxford

March 14, 2014
IMAPS-UK Annual Conference MicroTech

Click HERE to Register Now

IMAPS-UK’s MicroTech annual conference returns in 2014 – “Design for Packaging & Future Technology Trends” on 20 March at Rutherford Appleton Laboratories (RAL), Didcot, Oxford. With its updated one-day format, MicroTech 2014 will bring together the entire microelectronics supply chain and is the only UK event dedicated to Micro-Assembly and related technologies.  Click HERE for a review of 2013’s MircoTech, to see why you should attend in 2014!

The conference will feature Keynote talks, technical presentations & table top exhibits on the latest developments, technologies and capabilities, in addition to a high-impact session and poster displays from UK research.

MicroTech Agenda:

08:45 – Registration, Exhibition, Networking & Poster Reviews

09:30 – Session One: Keynote Opening
Keynote 1:UK based Graphene R&D and Benefits by Industrial Application – Prof. Ravi  Silva, University of Surrey ESP-KTN
Presentation: Status of TSB Graphene Competition & Special Interest Group, Dr Paul Huggett
Keynote 2: The Properties, Production and Promise of Graphene – Dr Stephan Hofmann, Cambridge University

10:35 – Coffee/Tea, Refreshments, Networking & Posters

11:05 – Session Two: Cutting Edge Research – Academic Show-Case (5x10minute presentations)

12:05 – IMAPS-UK Annual General Meeting

12:30 – Lunch, Refreshments, Networking & Posters

13:45 – Session Three: Future Technology Trends
Presentation 3: Future Potential of 3D Printing for Electronics Manufacture – Dr Robert Kay, Loughborough University
Presentation 4: Advances in Fan-Out WLP Technology eWLB – Paving the Way for High Density System Integration in Thin WLP – Dr Steffen Kröhnert, Nanium
Presentation 5: Interposers, a fully printed solution for low cost low volume production – Mr Ian Burnett, Interposers GmbH

14:45 – Coffee/Tea, Refreshments, Networking & Posters

15:15 – Session Four: Design For Packaging
Presentation 6: In the Hot Seat – The Design Challenges of High Temperature Packaging – Mr Piers Tremlett, Microsemi
Presentation 7: Taking The Stress Out Of Die Attach – Innovative Adhesives For MEMS Packaging – Speaker TBC, DELO

16:15 – Summary and Optional RAL / Diamond Tour

16:55 – Close

Who Should Attend:

End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Process Engineers, Product Designers & Students etc.

Delegate Registration:

The event is open to all including non IMAPS-UK members. If you or your Company are members of IMAPS-UK, the event is only £30 to attend (registration is required), otherwise the following delegate rates apply:

IMAPS-UK Member & Students: £30

IMAPS-UK Partners: £45 (JEMI-UK, IEEE-CPMT, ESP-KTN, IeMRC & NMI)
Non Member: £60

All prices plus VAT.

Click HERE to Register Now

Accomodation

Premier Inn
Milton Lodge Interchange, Milton Heights, Milton, Oxon OX14 4TX
Tel: +44 (0)871 527 8868
http://www.premierinn.com/en/checkHotel/DIDAPP/oxford-south-didcot

Kingswell Hotel,
Harwell, Oxon.
Tel: +44 (0)1235 833043
http://www.kingswell-hotel.com

Milton Hill House,
Milton Hill, Abingdon, Oxon. OX13 6AF
Tel: + 44 (0)871 222 4812
http://www.deverevenues.co.uk/en/venues/milton-hill-house

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