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Packaging workshop at Microsemi – July 3rd

May 19, 2014

This Unique Packaging Workshop, organised by IMAPS-UK and sponsored by Microsemi is your opportunity to learn about the technology of Semiconductor device Packaging and discover how to select the right solutions for your existing, new and emerging applications.

Featuring a series of technical presentations, user/supplier case studies, cleanroom tours and extensive networking time, the Workshop will review the key issues of packaging and will include:

• Basics of Packaging
• Hermeticity
• Plastic Packaging Trends
• User Case Studies
• Supplier Case Studies

Technical Programme:

The programme will consist of 3 workshop sessions, on Basics of Packaging, Hermeticity and Plastic Package Trends followed by short case studies, 3 from service providers and 3 from package users.

Attendees will also be invited to visit the Microsemi Caldicot facilities, the home of Microsemi’s Advanced Packaging Business. The company designs and develops miniaturised electronic modules which are at the heart of mission-critical projects in such applications as pacemakers, neurostimulators, sensors, hearing aids and patient monitoring.

The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that  now need to understand this very important technology area.  It will review the key issues of packaging, how to address these and how to develop the optimum packaging solution.

The outline programme is as follows:

Session 1 – “The basics & Trends of Packaging” by Mr Andy Longford, PandA Europe: 45 minutes + questions
Networking break & Cleanroom tour #1
Session 2 – “The need for Hermeticity” by Dr. Anne Vanhoest, UCL: 45 minutes + questions
Networking break & Cleanroom tour #2
Session 3 – “Packaging in Plastic QFN” by Mr Alan Evans, Unisem Europe: 45 minutes + questions
Lunch & Cleanroom tour #3
Session 4 – Packaging provider case studies by Optocap, Micross & Inseto: Each is 10 minutes + 5 minutes questions
Networking break & Cleanroom tour #4
Session 5 – Packaging user case studies by CSR, Microsemi “Embedded Die” & Selex ES: Each is 10 minutes + 5 minutes questions
Networking break & Cleanroom tour #5
Session 6: Wrap-up Session. Questions and Workshop Review; Attendee certificates given out

Who Should Attend?:

End-Users, Manufacturers, Production & Manufacturing Engineers, Researchers & Developers, Scientists, Supply Chain Companies, Process Engineers, Product Designers & Students etc.

Delegate Registration:

The event is open to all including non IMAPS-UK members:

IMAPS-UK Member: £155

IMAPS-UK Partner (NMI, IEEE-CPMT & JEMI-UK Members): £165

IMAPS-UK Student Member: £125 (IMAPS-UK is offering 100 free Student memberships for 2014, join us now!)

Non Member: £195

All prices are exclusive of VAT and include entry, workshop presentation notes & lunch/refreshments.

Click HERE to Register Now

 

Accommodation:

List courtesy of Microsemi, listed in order of distance from the plant:

Lychgate Guest House Caldicot

Two Rivers Hotel Chepstow

Marriott St Pierre Chepstow

Hampton by Hilton Magor

Hilton Newport

Holiday Inn Newport

Celtic Manor Resort Newport

 

Sponsorship Opportunities:

Interested in sponsoring this event?

For only £100 your Companies Sponsorship entitles you to a full page advert in the event programme and logo/website links on this events web page.

 

For further information, please contact:

Andy Longford, IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004
Email: office@imaps.org.uk
Packaging Workshop Registration Website: https://www.regonline.co.uk/pw14

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