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Heat of the Matter

August 27, 2014

Don’t miss our next event, Heat of the Matter, on October the 23rd at the University of Oxford, Begbroke Science Park, OX5 1PF.

The event will take bring together developers, manufacturers, end-users and supply chain companies to promote business opportunities in the advanced “High Temperature” electronics sector, presentations include:

•    “Keeping Cool!: Selecting High Performance Thermal Interface Materials” – Universal Science, Ian Loader
•    “High Temperature Sensor Conditioning and Processing in Aerospace Applications” – GE Aviation, Steve Riches
•    “The challenges of designing non ceramic packaging for 225C” – Microsemi, Piers Tremlett
•    “High Temperature Flex PCBs” – Trackwise, Philip Johnston                    
•    “Thermal Interface Materials in High Reliability Applications” – Indium Corporation, Graham Wilson”
•    “Engineering Copper Foams for Advanced Heat Transfer Applications” – Versarien, Will Battrick/Anthony Cooper              
•    “TIMs Test Methods, Characterisation and Standards”
•    “Practical Aspects of Thermal Interface Material Testing Methods” – DS&A LLC, David Saums 
•    “Development of National Standard Facilities for Characterising Thermal Transport Properties of Interface Materials” – NPL, Jiyu Xu

The event is open to all including non IMAPS-UK members; please visit our website for further information:
Or contact our secretariat
Andy Longford, IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004

We look forward to seeing you in Oxford!

The call for posters will be open until the end of September, send your abstracts to:


From → Events

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