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Thermal Interface Materials for Packaging – 23rd Oct – Oxford

September 24, 2014

Thermal Insulation Materials for Packaging

Want to know more?….
Book now for the IMAPS-UK “Heat of the Matter” (HtM)

Our forthcoming “Heat of the Matter” (HtM) Technical Conference, taking place on 23 October 2014 at University of Oxford, Begbroke Science Park, will soon be here.

The event brings together developers, manufacturers, end-users and supply chain companies to promote business opportunities in the advanced “High Temperature” electronics sector.

Topics include:
* Selecting High Performance Thermal Interface Materials
* Thermal Interface Materials in High Reliability Applications
* Thermal Interface Material Testing Methods
* TIMs Test Methods, Characterisation and Standards
* High Temperature Sensors in Aerospace Applications
* Designing Non Ceramic Packaging for High Temperature
* High Temperature Flex PCBs
* Copper Foams for Advanced Heat Transfer Applications

The event is open to all including non IMAPS-UK members.  Book now to ensure you have a place.

We look forward to seeing you in Oxford!

Thank you,

Andy Longford, IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004

For more details click here, and to register for the event click here

Indium Corporation


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