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IMAPS-UK Advanced Packaging Interconnect Workshop

May 4, 2015

IMAPS-UK is pleased to announce its forthcoming Advanced Packaging Interconnect Workshop taking place on 04 June 2015 in the Centre for Process Innovation (CPI) in Sedgefield.

This workshop, organised by IMAPS-UK and supported by The CPI, is your opportunity to learn about the technology of electronic device packaging interconnect, discover how to select the right solutions for your new and emerging applications and discuss the challenges of your field with experts.

The programme will consist of 4 workshop sessions on Advanced Packaging Interconnect aspects, followed by 6 short case studies covering a range of related applications and technologies. Attendees will also be invited to take a look at the assembly lines in the Centre for Process Innovation (CPI) Sedgefield facilities.

The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues of package interconnects, how to address these and how to develop optimum solutions.

Session One – Advanced Packaging & Interconnect for IOT: RFMOD
Session Two – Flip Chip & Bumping: STFC
Session Three – Sintering: Heraeus
Session Four – Flexible Interconnect: CPI
Session Five & Six – Case Studies Plus: CPI Facility Line Tour

There are limited places available and we expect the spaces to fill up quickly, so reserve your place without delay (all past IMAPS-UK Workshops have sold-out). Delegate rates are as follows:

IMAPS-UK Member: £155
IMAPS-UK Student Member: £125
IMAPS-UK Partner Rate: £155 (NMI, JEMI-UK & IEEE-CPMT Members)
Non Member: £195

Please visit our website for more details:

We look forward to seeing you at the Workshop!

Thank you,
Andy Longford, IMAPS-UK Secretariat
Telephone: + 44 (0)131 202 9004

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