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Power Packaging will Represent a $1.7B Market by 2020, 30% of the Power Module Market.

July 23, 2015

According to analysts Research and Markets, developments for power packaging are needed because power electronics is facing many challenges, due to both environmental and technical requirements. Increasing power density and power conversion optimization for CO2 emission reduction are key. To achieve ambitious governmental targets and to respect volume constraints, technology breakthroughs are needed at device and module level. Moreover, the growing and important role of wide band gap (WBG) semiconductors makes efficient packages mandatory, so that devices’ high frequency, high voltage or high temperature capabilities can be best exploited.

Maybe IMAPS-UK needs to consider an event on this topic in 2016. ?

Provided by Andy Longford from Panda Europe.

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From → Electronics, Finance, News

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