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The Future of High Temperature Interconnect – Webinar

August 25, 2015

The ELCOSINT collaborative R&D project (http://www.elcosint.co.uk/) will report on interconnect materials for use in electronics assemblies suitable for operating at temperatures above 250oC utilising standard manufacturing processes.

The Webinar will be on 16 September at 5:00pm covering:

  • Development of Materials
  • The Demonstrator Product
  • Testing & Results

To register for the webinar click here or go directly to the Registration website: https://attendee.gotowebinar.com/register/8980309965588835586

 

Posted by Anne Vanhoestenberghe, IMAPS UK, for the ELCOSINT project partners.

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