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The Future of High Temperature Interconnect – Webinar

August 25, 2015

The ELCOSINT collaborative R&D project ( will report on interconnect materials for use in electronics assemblies suitable for operating at temperatures above 250oC utilising standard manufacturing processes.

The Webinar will be on 16 September at 5:00pm covering:

  • Development of Materials
  • The Demonstrator Product
  • Testing & Results

To register for the webinar click here or go directly to the Registration website:


Posted by Anne Vanhoestenberghe, IMAPS UK, for the ELCOSINT project partners.


From → Events

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