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Market News

November 16, 2015

Analysts Research and Markets Ltd., advise that the future is bright for IC packaging.  Advances in IC packaging technologies are providing solutions to meet demands through a variety of techniques that result in ICs that are more powerful and provide greater functionality, while fitting into ever smaller and more highly integrated form factors. Multichip packages are on the leading edge of silicon integration, while advances in interconnection and substrate design are providing additional opportunities to improve package density.

They say that Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.

R&M also note that following an unexpectedly robust year of growth (9.2%), in 2014, the semiconductor industry moderated its expansion in the first half 2015. While the rate of growth for both semiconductors shipped and worldwide revenues will decline somewhat in the second half of 2016 (election year), the market is expected to post a respectable CAGR of 4.2% over the next five years.

And supporting the “photonics” developments – where UK is a big player, here is some more fireworks from R&M.

  • They value the Global photonics market at more than $154 billion in 2014 and it is expected to grow at a CAGR of 35% from 2015 to 2020.  The core photonics components market comprises 2,750 companies in 46 countries. These companies produce materials, LEDs, lasers, detectors, image sensors, lenses, prisms, optical filters, gratings, fiber optics, and other photonic components….. which all need packaging !
  • The global laser diode market, is expected to grow at a CAGR of 13.0% between 2015 and 2020. The Asia-Pacific region is expected to dominate the market at a CAGR of 15.0% between 2015 and 2020.

According to R&M, Optoelectronic components mainly consist of electronic devices capable of emitting light or reacting to it.  Their new report focuses on optoelectronic components which are semiconductor devices that are capable of interacting with light. These components have unique features of their own which makes them an ideal choice for a wide range of applications. The optoelectronic components market was valued at USD 32.17 Billion in 2014 and USD 55.53 Billion by 2020, at a CAGR of 9.41% from 2015 to 2020.

 

 

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