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Upcoming IMAPS-UK events

November 25, 2015

Wirebond workshop at the MTC on 3 December (now only a few places  left !!!) sponsored by ACCELONIX.  This event will cover the  Basics of Wire Bonding, Design and Optimisation, Application Examples, Quality, Testing and Reliability and of course will include some technical Case Studies.  Registration is still open at: https://www.regonline.co.uk/WBWS15

Low Temperature Joining workshop that will be held at the newly refurbished HENKEL facilities in Hemel Hempstead on Thursday  28 January 2016.  Full details are available to download from the new website and registration is now open on: https://www.regonline.co.uk/LTJWS

This workshop will provide an Introduction to the Markets for Flex, Plastic & Printed Electronics Systems, overview the Materials & Processes for Successful Low Temp Joining and look at the needs for Quality, Testing and Reliability. As will all our workshops there will be a good number of application examples as well.

IMAPS-UK’s annual conference MicroTech will take place at the prestigious Heriot-Watt University Campus in Edinburgh on 17th March 2016. The event features invited Keynote talks, technical presentations & table top exhibits on the latest developments, technologies and capabilities, in addition to a high-impact session and poster displays from UK research, on this year’s theme: “Sensors, MEMS & Advanced Packaging”.

The AGM will also be held during this conference.

Further, on 13 October, the JEMI joint meeting with EPIC the European photonics organisation at CASWELL, provided a superb overview of Semiconductor Technology given by Malcolm Penn and an excellent view of the outstanding manufacturing capability at the Oclaro Caswell facility.   This has prompted the proposal for a joint Conference on Photonics packaging in December 2016 (next year) to be held down in Torquay.  We will discuss this in full at our next committee meeting, but if you have an interest at all and would like to be involved please let us know.

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