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Low Temperature Joining – Adhesive Technology

December 21, 2015

This educational Workshop, organised by IMAPS-UK is being held on the 28th of January at the Henkel UK facility and is your opportunity to learn and to explore the technologies of Low Temperature Joining processes for packaging and assembly in Electronics.

Low temperature Joining is now a required and essential packaging technology for products using Flex, Plastic and Printed electronics. The development of materials and adhesives has made significant advances to meet the challenges in designs, materials and environments.
The programme will consist of 5 workshop sessions covering all aspects of the joining process as highlighted above and will include short case studies covering a range of related applications and technologies.
The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues of low temperature adhesive bonding and its applications in electronics packaging.

This workshop will cover:

  • An Introduction to the Markets for Flex, Plastic & Printed Electronics Systems
  • Materials & Processes for Successful Low Temp Joining
  • Quality, Testing and Reliability
  • Application Examples
      

The programme will consist of 5 workshop sessions, for a detailed agendo see: http://uk.imapseurope.org/index.php/event-main/events-jem/event/10-ltjws

The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area.

Register here.

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