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Dicing technology workshop – 19th May -Norwich (with a visit of Micross facilities)

Are you up to date with recent advances in dicing technology?   Could your company benefit from a better understanding of dicing blades or from learning about laser dicing?  Would you like to hear how several companies are using the latest developments to address the challenges they face?

Register for our workshop on Dicing Technologies, Thursday May the 19th in Norwich.  The event is sponsored by Micross, who will offer all attendees with an opportunity to visit their facilities.

Here is a copy of what our partners Jemi wrote about the event:
“……many of the companies using advanced wafer dicing are also customers of more front end orientated products especially as dicing becomes more technically challenging with hybrid wafers and sensitive MEMS devices and so on. This needs many of the chemicals that are common in front end processes and metrology and analytical techniques also. Recent developments using plasma dicing for ultra low damage and cleanliness requires all the accompanying products of any other deep etch process and is becoming increasingly the process of choice.

You may also not know Micross who are a specialist microelectronics manufacturer making devices and RF products for challenging applications in the military and aerospace arenas and also medical, oil and gas and now also own ELTEK SEMICONDUCTORS in Torquay.  These meetings are an excellent opportunity to meet and learn with potential customers in this area, it is another great networking opportunity for you.”


08.30 Registration & Coffee
09.00 Welcome & Introduction
09.15 Session 1 –“Basics of Dicing” – Andy Longford -PandA Europe
10.00 Session 2 – “Blade Technologies” – John Govier – Inseto
10.45 Networking Break
11.30 Session 3 – “Dicing Equipment and Capabilities”  – Christoph Epple – Disco
12.30 Lunch & Networking
13.15 Micross Facility Tour
14.00 Session 4 – “New Dicing Technologies”

a) Laser Technologies  – Andy Longford – PandA Europe

b) Plasma – Richard Barnett – SPTS

15.00 Networking Break
15.30 Session 5 – Application Case Studies

a) Micross

b) FSL – Fico

c) Inseto – ADT

d) Plasma-Therm

16.50 Workshop Wrap-up
17.00 End of workshop


Microtech 17th March 2016 – Where the Microelectronics industry meets.

We have reached 100 registrations so don’t delay, register NOW to secure your place.

Our annual MicroTech event enables you to keep up-to-date with the latest technology and developments, plus network with leading experts and companies in the sector.

Here are our top ten reasons why you should attend:

1. UK’s only dedicated Microelectronics / Advanced Packaging event.
2. Nine presentations on the latest developments & technologies.
3. Keynotes from: Semefab, Unisem & System Plus.
4. A Unique panel session on “Engaging with Industry for Academics” to explore alternative ways to acquire know-how, expand your expertise.
5. High-impact academic research session with 13 posters presentations.
6. 18 table top exhibits from leading suppliers.
7. Low cost to attend: free parking, buffet lunch & refreshments.
8. Extensive networking opportunities (over 100 attendees).
9. Incorporates the IMAPS-UK Annual General Meeting.
10. Organised by the industry experts IMAPS-UK.


Delegate Registration: The event is open to all, including non IMAPS-UK members, the following delegate rates apply:

Member £75
Student £30
Event Partners: £95
Non Member: £125
All prices plus VAT.

Register HERE now to secure your place!

Full details can be found on our website (


We look forward to seeing you at MicroTech.


Note: we have two exhibitor table-tops available – to reserve yours contact the IMAPS-UK Secretariat: Telephone: + 44 (0)131 202 9004 or Email:

Events for 2016

On 28 January we will be holding a Low Temperature Joining workshop at the HENKEL facility in Hemel Hempstead. This is a full technical workshop about Adhesive technologies that is supported by Henkel Electronics Adhesives and will include presentations from CPI, GEM, NPL , Pragmatic, Novalia and Fraunhofer EMT. Places are limited to 50 persons only and only a few places remain.  For more info:


On 17 March our Annual conference, MICROTECH, will take place at Heriot-Watt University, Edinburgh.  The theme this year is “Sensors, MEMS and Advanced Packaging” and we have a range of excellent speakers, the usual exhibition and posters plus a session of high-impact short research presentations.  Places are already being booked for the exhibition as well as delegates so visit the IMAPS-UK website to register:

The Annual general meeting will also be held during the MicroTech event, as usual.  If you want to be part of the IMAPS-UK organisation, member nominations for committee will be sent out in February along with the AGM meeting notice.


Finally, IMAPS-UK will be holding a DICING Technology workshop on Thursday 19 May, at the Mercure Hotel, Norwich.  This event will cover all aspects of dicing from blade technology through to the new Plasma dicing options.  For more info on this and all other IMAPS-UK events:


Partner events

IMAPS Nordic has announced that their 2016 conference will be held in Norway at Tønsberg in the centre of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo. The call for abstract or suggestion for papers is out and must be non-commercial and submitted in electronic form to  no later than March 7, 2016. Speakers will be notified of paper acceptance by email by March 20.  For the latest information about the conference and the exhibition, visit the homepage at:


Conference on Electric Contacts, organised organised by Heriot-Watt University in Edinburgh, 6-9 June 2016. The conference will be of interest to some of our members, especially those in the power and automotive industries. It is a bi-annual conference and this one is led by Jonathan Swingler.  More information is available at the conference webpage: http://contacts2

Market News December 2015

The distributed fibre optic sensor market stood at $585 million in 2013 and is projected to approach $1.05 billion in 2019. (According to analysts Research & Markets). In particular, the military market segment is showing signs of growing more rapidly than any other.  A Possible good reason for IMAPS-UK to consider a Photonics Packaging conference in the latter part of 2016 – in conjunction with JEMI and EPIC.

Another report provides the segmentation of existing and future photonics technologies embedded in cars as well as market forecasts of Photonics in all segments : ADAS (Advanced Driver Assistance System), Interior of the cabin, Exterior of the car, Powertrain. ADAS is one of the most promising segments in terms of economic perspective for photonic technologies manufacturers. Indeed, the market of Photonics in ADAS will grow from around $2.8b in 2014 to around $9b in 2020 with a CAGR2015-2020 of around 22%. Today limited to few thousands of units per year in the luxury car segment, high-end photonic systems have the potential to reach tens or hundreds of millions units/year thanks to strong cost decreases while keeping high performance abilities.

In another report, R&M state that the Optoelectronic Components Market Is Expected to Reach USD 55.53 Billion by 2020.  This report focuses on optoelectronic components which are semiconductor devices that are capable of interacting with light (photonic detectors and LEDs come to mind )….. These components have unique features of their own which makes them an ideal choice for a wide range of applications. This optoelectronic components market was valued at USD 32.17 Billion in 2014.  Just considering  Infrared Photodetectors, these  are reaching new opportunities in Defence systems and also in commercial and industrial markets . The IR imaging Photodetectors market is expected to grow from around $700M in 2013 to more than $900M in 2020.  The VCSEL market was valued at USD 611.3 Million in 2014, and is projected to grow at a CAGR of 21.99% from 2015 to 2020, expected to reach USD 2,105.3 Million by 2020.

Low Temperature Joining – Adhesive Technology

This educational Workshop, organised by IMAPS-UK is being held on the 28th of January at the Henkel UK facility and is your opportunity to learn and to explore the technologies of Low Temperature Joining processes for packaging and assembly in Electronics.

Low temperature Joining is now a required and essential packaging technology for products using Flex, Plastic and Printed electronics. The development of materials and adhesives has made significant advances to meet the challenges in designs, materials and environments.
The programme will consist of 5 workshop sessions covering all aspects of the joining process as highlighted above and will include short case studies covering a range of related applications and technologies.
The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area. It will review the key issues of low temperature adhesive bonding and its applications in electronics packaging.

This workshop will cover:

  • An Introduction to the Markets for Flex, Plastic & Printed Electronics Systems
  • Materials & Processes for Successful Low Temp Joining
  • Quality, Testing and Reliability
  • Application Examples

The programme will consist of 5 workshop sessions, for a detailed agendo see:

The workshop, which will be limited in numbers, is aimed at electronic system developers, manufacturers and end-users as well as design companies that now need to understand this very important technology area.

Register here.

JEMI Workshop at Airbus Defence

JEMI are holding a Technical Visit, Workshop & Exhibition at Airbus Defence and Space in Portsmouth on Thursday 17th December (also next week!)

The main area of interest there is in making instrumentation which includes all kinds of sensors, solar energy collectors, power management and radar and observation instruments, all of which involves technology in our area. Our host will be Lee Birch who is the Technology Engineering Manager and Ralph Green who is the R+D Manager who will be assisting. There will be other attendees and speakers from Airbus on the day, and as usual there is a table top exhibit space adjacent to the meeting room where we will be circulating during the breaks. Publicity will advertise the exhibits to the employees who can visit to during the lunch break.

The day will start at 09.30 with coffee and registration and will continue until 4pm. The site is a secure site so registration must be completed on the JEMI website and you will not be able to just turn up on the day and get in. Non British passport holders will need 5 days before the event for security clearance and all others 2 days so please don’t leave it until the last minute.

The exhibition and event as a whole is free to members of JEMI and IMAPS. For non-members the cost is £50 for the event and £50 per table top. Please register for this event via the following link as soon as possible: WWW.JEMIUK.COM

Power Electronics – Thermal Characterisation and Reliability

“Power Electronics – Thermal Characterisation & Reliability” – at the University of Nottingham, Tuesday 15th December 2015

You are invited  to spend the day with the University of Nottingham learning about the latest measurement system for fast, accurate, automated power cycling of power electronics components (MOSFETS, IGBTs, etc.) with integral thermal stack characterisation to track cause and effect for failure analysis. There will be presentations from the University of Nottingham and Mentor Graphics plus a lab tour, including a demonstration of the MicReD Power Tester 1500A.

This one day event is offered free of charge and complimentary refreshments and lunch are provided.  To reserve your place, please register today by following the link below – numbers are limited and availability is on a first come, first served basis!

Wirebond workshop

Wirebond workshop at the MTC on 3 December (now only a few places  left !!!) sponsored by ACCELONIX.  This event will cover the  Basics of Wire Bonding, Design and Optimisation, Application Examples, Quality, Testing and Reliability and of course will include some technical Case Studies.  Registration is still open at:

Upcoming IMAPS-UK events

Wirebond workshop at the MTC on 3 December (now only a few places  left !!!) sponsored by ACCELONIX.  This event will cover the  Basics of Wire Bonding, Design and Optimisation, Application Examples, Quality, Testing and Reliability and of course will include some technical Case Studies.  Registration is still open at:

Low Temperature Joining workshop that will be held at the newly refurbished HENKEL facilities in Hemel Hempstead on Thursday  28 January 2016.  Full details are available to download from the new website and registration is now open on:

This workshop will provide an Introduction to the Markets for Flex, Plastic & Printed Electronics Systems, overview the Materials & Processes for Successful Low Temp Joining and look at the needs for Quality, Testing and Reliability. As will all our workshops there will be a good number of application examples as well.

IMAPS-UK’s annual conference MicroTech will take place at the prestigious Heriot-Watt University Campus in Edinburgh on 17th March 2016. The event features invited Keynote talks, technical presentations & table top exhibits on the latest developments, technologies and capabilities, in addition to a high-impact session and poster displays from UK research, on this year’s theme: “Sensors, MEMS & Advanced Packaging”.

The AGM will also be held during this conference.

Further, on 13 October, the JEMI joint meeting with EPIC the European photonics organisation at CASWELL, provided a superb overview of Semiconductor Technology given by Malcolm Penn and an excellent view of the outstanding manufacturing capability at the Oclaro Caswell facility.   This has prompted the proposal for a joint Conference on Photonics packaging in December 2016 (next year) to be held down in Torquay.  We will discuss this in full at our next committee meeting, but if you have an interest at all and would like to be involved please let us know.

Market News

Analysts Research and Markets Ltd., advise that the future is bright for IC packaging.  Advances in IC packaging technologies are providing solutions to meet demands through a variety of techniques that result in ICs that are more powerful and provide greater functionality, while fitting into ever smaller and more highly integrated form factors. Multichip packages are on the leading edge of silicon integration, while advances in interconnection and substrate design are providing additional opportunities to improve package density.

They say that Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.

R&M also note that following an unexpectedly robust year of growth (9.2%), in 2014, the semiconductor industry moderated its expansion in the first half 2015. While the rate of growth for both semiconductors shipped and worldwide revenues will decline somewhat in the second half of 2016 (election year), the market is expected to post a respectable CAGR of 4.2% over the next five years.

And supporting the “photonics” developments – where UK is a big player, here is some more fireworks from R&M.

  • They value the Global photonics market at more than $154 billion in 2014 and it is expected to grow at a CAGR of 35% from 2015 to 2020.  The core photonics components market comprises 2,750 companies in 46 countries. These companies produce materials, LEDs, lasers, detectors, image sensors, lenses, prisms, optical filters, gratings, fiber optics, and other photonic components….. which all need packaging !
  • The global laser diode market, is expected to grow at a CAGR of 13.0% between 2015 and 2020. The Asia-Pacific region is expected to dominate the market at a CAGR of 15.0% between 2015 and 2020.

According to R&M, Optoelectronic components mainly consist of electronic devices capable of emitting light or reacting to it.  Their new report focuses on optoelectronic components which are semiconductor devices that are capable of interacting with light. These components have unique features of their own which makes them an ideal choice for a wide range of applications. The optoelectronic components market was valued at USD 32.17 Billion in 2014 and USD 55.53 Billion by 2020, at a CAGR of 9.41% from 2015 to 2020.



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